Semiconductor devices with cavities

ABSTRACT

A semiconductor device comprises a first semiconductor wafer including a cavity formed in the first semiconductor die. A second semiconductor die is bonded to the first semiconductor die over the cavity. A first transistor includes a portion of the first transistor formed over the cavity.

CROSS-REFERENCE TO RELATED APPLICATIONS

The present application is a continuation of U.S. patent applicationSer. No. 14/966,783 filed Dec. 11, 2015, now U.S. Pat. No. 9,666,703,which application claims the benefit of U.S. Provisional Application No.62/092,903, filed Dec. 17, 2014, the contents of all such applicationsbeing incorporated herein by reference in their entirety.

BACKGROUND

Semiconductor devices are commonly found in modern electronic products.Semiconductor devices vary in the number and density of electricalcomponents. Discrete semiconductor devices generally contain one type ofelectrical component, e.g., light emitting diode (LED), small signaltransistor, resistor, capacitor, inductor, and powermetal-oxide-semiconductor field-effect transistor (MOSFET). Integratedsemiconductor devices typically contain hundreds to millions ofelectrical components. Examples of integrated semiconductor devicesinclude microcontrollers, microprocessors, charged-coupled devices(CCDs), solar cells, and digital micro-mirror devices (DMDs).

Semiconductor devices perform a wide range of functions such as signalprocessing, high-speed calculations, transmitting and receivingelectromagnetic signals, controlling electronic devices, transformingsunlight to electricity, and creating visual projections for televisiondisplays. Semiconductor devices are found in the fields ofentertainment, communications, power conversion, networks, computers,and consumer products. Semiconductor devices are also found in militaryapplications, aviation, automotive, industrial controllers, and officeequipment. In particular, power MOSFETs are commonly used in electroniccircuits, such as communication systems and power supplies, as electricswitches to enable and disable the conduction of relatively largecurrents in, e.g., DC-to-DC voltage converters, power supplies, andmotor controllers.

A power MOSFET device includes a large number of MOSFET cells orindividual transistors that are connected in parallel and distributedacross a surface of a semiconductor die. Power MOSFET devices aretypically used as electronic switches to control power flow to acircuit. A control signal at a gate of the power MOSFET controls whethercurrent flows through the MOSFET between a drain terminal and sourceterminal of the MOSFET. The conduction path between the drain terminaland source terminal of a MOSFET is wired in series with a circuit to beswitched, so that when the MOSFET is off, i.e., the MOSFET limitselectric current between the source and drain terminals, current islimited through the switched circuit. When the MOSFET is on, electriccurrent flows through both the MOSFET and the switched circuit, inseries, to power the switched circuit.

One specification of a power MOSFET is the MOSFET's parasiticcapacitances. Parasitic capacitances are capacitances that exist betweenthe conductive parts of an electronic component or device because of theproximity of the conductive elements to each other. Parasiticcapacitance generally exists in a power MOSFET between the gate andsource of the MOSFET, between the gate and drain, as well as between thedrain and source. Parasitic capacitance becomes a more significantfactor when a power MOSFET is operated at higher frequency.

SUMMARY

Accordingly, in one embodiment, the present invention is a method ofmaking a semiconductor device comprising providing a first semiconductorwafer, forming a cavity in the first semiconductor wafer, bonding asecond semiconductor wafer to the first semiconductor wafer over thecavity, and forming a transistor including a portion of the transistorover the cavity.

In another embodiment, the present invention is a method of making asemiconductor device comprising providing a first semiconductor die,forming a cavity in the first semiconductor die, bonding a secondsemiconductor die to the first semiconductor die over the cavity, andforming a transistor including a gate of the transistor formed over thecavity.

In another embodiment, the present invention is a semiconductor devicecomprising a first semiconductor die including a cavity formed in thefirst semiconductor die. A second semiconductor die is bonded to thefirst semiconductor die over the cavity. A first transistor includes aportion of the first transistor formed over the cavity.

BRIEF DESCRIPTION OF THE DRAWINGS

FIGS. 1a-1c illustrate formation of a cavity wafer;

FIGS. 2a-2c illustrate formation of a cavity wafer in an alternativeembodiment;

FIGS. 3a-3c illustrate formation of a cavity wafer in anotheralternative embodiment;

FIGS. 4a-4c illustrate formation of a cavity wafer in a thirdalternative embodiment;

FIGS. 5a-5e illustrate doping of a device wafer and alignment of thedoping regions to the cavity;

FIG. 6 illustrates a completed quasi-lateral power MOSFET including acavity wafer;

FIGS. 7a-7c illustrate forming a lateral MOSFET with a cavity wafer;

FIGS. 8a-8d illustrate forming a vertical trench MOSFET with a cavitywafer; and

FIGS. 9a-9d illustrate forming a vertical planar-gate MOSFET with acavity wafer.

DETAILED DESCRIPTION

The present invention is described in one or more embodiments in thefollowing description with reference to the figures, in which likenumerals represent the same or similar elements. While the invention isdescribed in terms of the best mode for achieving objectives of theinvention, those skilled in the art will appreciate that the disclosureis intended to cover alternatives, modifications, and equivalents as maybe included within the spirit and scope of the invention as defined bythe appended claims and claims equivalents as supported by the followingdisclosure and drawings.

Semiconductor devices are generally manufactured using two complexmanufacturing processes: front-end manufacturing and back-endmanufacturing. Front-end manufacturing involves the formation of aplurality of die on the surface of a semiconductor wafer. Each die onthe wafer contains active and passive electrical components, which areelectrically connected to form functional electrical circuits. Activeelectrical components, such as transistors and diodes, have the abilityto control the flow of electrical current. Passive electricalcomponents, such as capacitors, inductors, and resistors, create arelationship between voltage and current necessary to perform electricalcircuit functions.

Passive and active components are formed over the surface of thesemiconductor wafer by a series of process steps including doping,deposition, photolithography, etching, and planarization. Dopingintroduces impurities into the semiconductor material by techniques suchas ion implantation or thermal diffusion. The doping process modifiesthe electrical conductivity of semiconductor material in active devicesby dynamically changing the semiconductor material conductivity inresponse to an electric field or base current. Transistors containregions of varying types and degrees of doping arranged as necessary toenable the transistor to promote or restrict the flow of electricalcurrent upon the application of the electric field or base current.

A region of a semiconductor wafer can be negatively doped or positivelydoped. Negatively doped, or N-doped, regions are doped with a negative,or N-type, dopant, such as phosphorus, antimony, or arsenic. Eachmolecule of an N-type dopant contributes an additional negative chargecarrier, i.e., an electron, to the semiconductor wafer. Positivelydoped, or P-doped, regions are doped with a positive, or P-type, dopantsuch as boron, aluminum, or gallium. Each molecule of P-type dopantcontributes an additional positive charge carrier, i.e., an electronhole, to the semiconductor wafer. A region of one doping type can bemade into a region of the other doping type by adding dopant of thesecond type in excess of the existing doping concentration. N-type andP-type regions are oppositely doped.

Active and passive components are formed by layers of materials withdifferent electrical properties. The layers can be formed by a varietyof deposition techniques determined in part by the type of materialbeing deposited. For example, thin film deposition can involve chemicalvapor deposition (CVD), physical vapor deposition (PVD), electrolyticplating, and electroless plating processes. Each layer is generallypatterned to form portions of active components, passive components, orelectrical connections between components.

Back-end manufacturing refers to cutting or singulating the finishedwafer into the individual semiconductor die and packaging thesemiconductor die for structural support, electrical interconnect, andenvironmental isolation. To singulate the semiconductor die, the waferis scored and broken along non-functional regions of the wafer calledsaw streets or scribe lines. The wafer is singulated using a lasercutting tool or saw blade. After singulation, the individualsemiconductor die are mounted to a package substrate that includes pinsor contact pads for interconnection with other system components.Contact pads formed over the semiconductor die are then connected tocontact pads within the package. The electrical connections can be madewith conductive layers, bumps, stud bumps, conductive paste, orwirebonds. An encapsulant or other molding material is deposited overthe package to provide physical support and electrical isolation. Thefinished package is then inserted into an electrical system and thefunctionality of the semiconductor device is integrated into the system.

FIG. 1a shows a cross-sectional view of a portion of handle wafer 10.Handle wafer 10 is a semiconductor wafer formed from a base substratematerial, such as silicon, germanium, aluminum phosphide, aluminumarsenide, gallium arsenide, gallium nitride, indium phosphide, siliconcarbide, or other bulk semiconductor material. In one embodiment, handlewafer 10 has a width or diameter of 200-300 millimeters (mm). In anotherembodiment, handle wafer 10 has a width or diameter of 100-450 mm.

Handle wafer 10 is doped with an N-type dopant, such as phosphorus,antimony, or arsenic, to form an N+ doped substrate. N+ doping indicatesa relatively strong concentration of N-type dopants in handle wafer 10.Dopants are added while growing the semiconductor boule that handlewafer 10 is cut from, to provide an approximately uniform initial dopingthroughout the wafer. In other embodiments, handle wafer 10 is doped toan N+ substrate using diffusion, ion implantation, or other suitableprocesses. Handle wafer 10 becomes the drain contact of a subsequentlyformed MOSFET. Handle wafer 10 is negatively doped because handle wafer10 is coupled to the drain of an N-channel MOSFET device. If a P-channeldevice is being formed, handle wafer 10 is doped with a P-type dopant.In one embodiment, handle wafer 10 is disposed over a temporary orsacrificial carrier for processing.

A portion of handle wafer 10 is removed by an etching process that usesmask 16, which is a photoresist layer in some embodiments, to formcavities 20. Mask 16 protects portions of handle wafer 10 while anetching process removes material of the wafer not covered by mask 16.Various wet and dry etching techniques are usable to form cavities 20.In one embodiment, reactive-ion etching is used to form cavities 20.Cavities 20 are formed as the etching process removes base substratematerial of handle wafer 10 outside of the footprint of mask 16.

Cavities 20 include sidewalls 22. Sidewalls 22 are illustrated assloping away from cavities 20, but include other slopes, and shapesother than linear, in other embodiments. The slope and shape ispartially determined by the isotropy of the particular etching methodused. Sidewalls 22 slope into cavity 20, out of cavity 20, or areperpendicular to surfaces of handle wafer 10 in various embodiments. Inother embodiments, sidewalls 22 are linear, rounded, or include othershapes.

Cavities 20 are shaped as stripes extending into and out of FIG. 1 b.Cavities 20 extend across handle wafer 10 in a direction perpendicularto the page of FIG. 1b because the eventually formed MOSFETs are formedas stripes over handle wafer 10. However, in other embodiments, whereMOSFETs are formed in other shapes and patterns, cavities 20 are shapedas needed to provide for cavity 20 to extend under subsequently formedgates of the MOSFET. In one embodiment, cavities 20 are formed brokeninto discrete line segments across handle wafer 10 or device wafer 30rather than uninterrupted stripes. The depth of cavity 20 into handlewafer 10 is between one and ten micrometers (μm) and the width of cavity20 is approximately twice the length of a subsequently formed driftregion in some embodiments. As drift length scales with breakdownvoltage (BVdss), a BVdss of 600 volts results in a width of cavity 20between approximately 60 μm and 100 μm. Lower voltage devices mayutilize a thinner and shallower cavity 20.

After etching of cavity 20 is complete, handle wafer 10 is cleaned usingchemical-mechanical polishing (CMP), mechanical planarization, or othersuitable methods, to remove remaining portions of mask 16. The result ofthe cleaning process is handle wafer 10, which is N+ doped and includescavities 20 as illustrated in FIG. 1 b.

After cavities 20 are formed in handle wafer 10, and handle wafer 10 ispolished, a device wafer 30 is disposed over handle wafer 10. Devicewafer 30 is an undoped or lightly doped wafer of semiconductor material.Device wafer 30 is bonded to handle wafer 10 using direct wafer-to-waferbonding. Handle wafer 10 and device wafer 30 are annealed at elevatedtemperatures so that the lattice structures of the semiconductor atomscombine. In the case of handle wafer 10 and device wafer 30 being formedof Si, covalent Si—Si bonds are established between opposing surfaces ofhandle wafer 10 and device wafer 30.

Handle wafer 10 bonded to device wafer 30 with cavities 20 betweenhandle wafer 10 and device wafer 30 constitutes a cavity wafer 32. Inone embodiment, device wafer 30 is provided as a wafer havingsubstantially the same diameter and thickness as handle wafer 10. Devicewafer 30 is thinned using a backgrinding or polishing process afterbonding to reduce a thickness of device wafer 30. The thickness ofdevice wafer 30 is reduced to a desired thickness for forming thevarious doped regions of a MOSFET.

FIGS. 2a-2c illustrate an alternative embodiment of forming a cavitywafer 34. An epitaxial layer 12 is grown on handle wafer 10. Epitaxiallayer 12 includes an N-type doping with a lower concentration of dopantsthan in handle wafer 10. Epitaxial layer 12 is doped by addingimpurities during the formation of epitaxial layer 12. Mask 16 is usedto form cavities 20 in epitaxial layer 12, as shown in FIG. 2 b.

Remaining portions of mask 16 are removed, leaving cavities 20 extendingperpendicular to the page as stripes across handle wafer 10. Portions ofepitaxial layer 12 remain around cavities 20. In some embodiments, aportion of epitaxial layer 12 remains at the bottom of cavities 20. Inother embodiments, cavities 20 extend into handle wafer 10. In FIG. 2 c,device wafer 30 is bonded to epitaxial layer 12 over handle wafer 10 andcavities 20 to form cavity wafer 34. In some embodiments, device wafer30 is thinned to a desired thickness after device wafer 30 is bonded toepitaxial layer 12. Cavity wafer 34 in FIG. 2c is similar to cavitywafer 32 in FIG. 1 c, except that cavity wafer 34 includes epitaxiallayer 12. Epitaxial layer 12 provides a relatively lightly doped regionbetween handle wafer 10 and device wafer 30.

Use of epitaxial layer 12 increases the thermal budget of the bondingprocess between handle wafer 10 and device wafer 30. During bonding,heat used causes dopants to spread from handle wafer 10 and into devicewafer 30. Epitaxial layer 12 creates separation between handle wafer 10and device wafer 30 to reduce the amount of dopants which aretransferred into device wafer 30 during the anneal process.

FIGS. 3a-3c illustrate a third embodiment of forming a cavity wafer 36.In FIG. 3 a, epitaxial layer 12 is grown on device wafer 30. Cavities 20are etched into epitaxial layer 12 using mask 16 with epitaxial layer 12on device wafer 30. After cavities 20 are formed in epitaxial layer 12,remaining portions of mask 16 are removed. FIG. 3b illustrates devicewafer 30 and epitaxial layer 12, including cavities 20, after remainingportions of mask 16 are removed.

In FIG. 3 c, handle wafer 10 is provided, on a temporary carrier in someembodiments, as a substrate. Device wafer 30 and epitaxial layer 12 areflipped and disposed over handle wafer 10. A thermal anneal is performedto bond epitaxial layer 12 to handle wafer 10. Device wafer 30 is bondedto handle wafer 10 via epitaxial layer 12 with cavities 20 disposedbetween handle wafer 10 and device wafer 30 to form cavity wafer 36.Cavity wafer 36 is similar to cavity wafer 34, with epitaxial layer 12between handle wafer 10 and device wafer 30. However, epitaxial layer 12was grown on device wafer 30 instead of handle wafer 10. Sidewalls 22 ofcavities 20 are illustrated slopping in opposite directions betweenFIGS. 2c and 3c because of the growth of epitaxial layer 12 on theopposite wafer, but other cavity wafer embodiments could have cavitysidewalls of any appropriate slope in practice.

In a fourth embodiment of forming a cavity wafer, illustrated in FIGS.4a -4 c, cavities 20 are formed directly in device wafer 30 without theuse of epitaxial layer 12. Device wafer 30 is provided as sufficientlythick to accommodate formation of cavities 20, followed by a thinning ofdevice wafer 30 if needed. Device wafer 30 is bonded to handle wafer 10after formation of cavities 20 in device wafer 30 to form cavity wafer38, as illustrated in FIG. 4 c.

FIG. 5a illustrates cavity wafer 32 with device wafer 30 doped for usein one MOSFET embodiment. Device wafer 30 includes P-channel region 50,P+ body contact 54, N+ source region 60, N+ drain region 64, and driftregion 70. While an N-channel MOSFET is illustrated, a P-channel MOSFETis formed by doping each region with an opposite type of dopant. Inaddition, device wafer 30 is doped similarly in other cavity waferembodiments to form a MOSFET device based on, e.g., cavity wafers 34,36, or 38.

Each of the doped regions 50, 54, 60, 64, and 70 are formed using acorresponding photoresist mask, similar to mask 16. Doped regions 50,54, 60, 64, and 70 each extend across cavity wafer 32 in parallel withcavities 20, e.g., as stripes into and out of the page as illustrated inFIG. 5 b. A photoresist layer is formed over substantially the entiretop surface of device wafer 30, and the photoresist layer is etched awayover an area to be doped. For instance, to dope P+ body contact 54, anopening in the photoresist layer is formed over the desired location forP+ body contact 54. As dopants are implanted into device wafer 30 fromabove, the dopants are successfully implanted into device wafer 30 whereopenings in the photoresist layer are located. Where the photoresistlayer remains, dopants are blocked by the photoresist layer from beingimplanted into device wafer 30 in significant quantities. In someembodiments, multiple implant steps are used for each doped area.Varying the energy of the dopant implantation results in depositingdopants to a varying depth in device wafer 30.

After doping of a first region in device wafer 30, the photoresist maskis removed, and another photoresist mask is applied to dope anotherregion of device wafer 30. In some embodiments, a single mask is used todope every region of device wafer 30 that is similarly doped in a singleimplantation step. The various regions of device wafer 30 are doped inany appropriate order. In one embodiment, device wafer 30 is providedinitially to have a desired doping concentration of one of the finaldoped regions, and then a specific mask is not needed to dope the regionin question.

P+ body contact 54 and N+ source region 60 are doped with a relativelyhigh concentration in order to provide good ohmic contact to a metallayer, which will be subsequently formed over P+ body contact 54 and N+source region 60. The contact between source metal layers and P-channelregions 50 provided by P+ body contact 54 biases a parasitic NPN BJTtransistor formed by N+ source region 60, P-channel region 50, and driftregion 70. The biasing of the parasitic NPN BJT transistor reduces thelikelihood of latch-up occurring. Doping N+ source region 60 with ahigher concentration of dopants reduces contact resistance and theoverall resistance of current through the MOSFET device from drain tosource. N+ source region 60 operates as the source of the MOSFET as wellas providing good ohmic contact. N+ drain regions 64 are doped with arelatively high concentration to provide good electrical contact withhandle wafer 10. N+ drain regions 64 are formed at least partiallyoutside of a footprint of cavity 20 to contact handle wafer 10, orepitaxial layer 12 formed over handle wafer 10. Handle wafer 10 servesas the drain contact of the MOSFET cell.

Drift region 70 is doped with N-type dopant. Drift region 70 istypically doped relatively lightly to support a higher breakdown voltagefrom drain to source. Drift region 70 and N+ source region 60 are bothdoped with negative dopant, while P-channel region 50 is formed withpositive dopant between N+ source region 60 and drift region 70. BecauseP-channel region 50 includes an opposite majority carrier than driftregion 70 and P+ body contact 54, electric current does not normallyflow through the MOSFET from drain to source. A gate subsequently formedover P-channel region 50, e.g. gate 74 in FIG. 5, is provided with apositive charge, which results in an electric field that attractselectrons, i.e., negative carriers, to the area of P-channel region 50between drift region 70 and N+ source region 60. When a sufficientcharge is applied to the gate, and enough electrons are gathered betweenN+ source region 60 and drift region 70, current flows from drain tosource via drift region 70, P-channel region 50, and N+ source region60.

In other embodiments, other types of drift regions are used. In oneembodiment, drift region 70 is doped with a linear or other gradient toform a reduced surface field (RESURF) drift region. Forming drift region70 as a RESURF drift region reduces the electric field at the junctionbetween drift region 70 and P-channel region 50 by spreading out theelectric field throughout drift region 70. Spreading out the electricfield allows a higher doping concentration in drift region 70, whichreduces the resistance of current through the MOSFET. In anotherembodiment, drift region 70 is a superjunction, as illustrated in FIG. 5b. Forming drift region 70 as a superjunction involves forming chargebalanced N stripes 70 a and P stripes 70 b that deplete as the drainvoltage is increased relative to the source voltage. Each of the Nstripes 70 a and P stripes 70 b of drift region 70 extends from N+ drainregion 64 to P-channel region 50. N stripes 70 a and P stripes 70 b ofthe superjunction of drift region 70 are formed using two separate masksin one embodiment.

Improvements in the precision of the alignment of doped regions 50, 54,60, 64, and 70 relative to cavities 20 provides advantages in theoperation of quasi-lateral MOSFET 100. FIG. 5a illustrates idealalignment, where the width of contact between handle wafer 10 and devicewafer 30 is exactly the same width as and exactly aligned over drainregions 64. In practice, the contact between handle wafer 10 and devicewafer 30 will commonly be offset relative to N+ drain region 64.Cavities 20 are not easily visible through device wafer 30, so alignmentis limited based on tolerances of dopant deposition and ability toaccurately recall where cavities 20 are located within cavity wafer 32.FIGS. 5c-5e illustrate methods of improving alignment of the doping ofdevice wafer 30 or handle wafer 10 relative to cavities 20.

In FIG. 5 c, the width of N+ drain region 64 is increased to at leastthe sum of the distance between adjacent cavities 20 and any alignmenttolerances involved. With a widened N+ drain region 64, the physicalcontact between handle wafer 10 and device wafer 30 occurs entirelywithin the footprint of N+ drain region 64 even at a maximum expectedmisalignment. Drift regions 70 remain entirely within a footprint ofcavities 20.

FIG. 5d illustrates a fiducial marker 72 disposed in a top surface ofhandle wafer 10 outside of cavity 20. Device wafer 30 is thinned duringthe formation of cavity wafer 32. After thinning, device wafer 30 istransmissive to a limited amount of light. Some light is allowed to passthrough device wafer 30, although directly observing cavities 20 throughdevice wafer 30 is a challenge. Fiducial marker 72 provides significantoptical contrast with handle wafer 10. Fiducial marker 72 is visiblethrough device wafer 30, using the visible light spectrum or otherfrequencies of electromagnetic radiation, allowing accurate alignment ofdoping relative to cavities 20. Fiducial marker 72 is disposed withinepitaxial layer 12 in embodiments that form cavity 20 in epitaxial layer12.

In FIG. 5 e, drift region 70 extends completely between two adjacentP-channel regions 50. Less precise alignment is acceptable in theembodiment of FIG. 5e because contact between handle wafer 10 and devicewafer 30 occurs within drift region 70 even with a large misalignment.In some embodiments where physical contact is provided between driftregion 70 and the area surrounding cavities 20, epitaxial layer 12 isused rather than direct physical contact between handle wafer 10 anddevice wafer 30. The lower dopant concentration of epitaxial layer 12reduces the strength of electric fields near the surface of device wafer30 to reduce the likelihood of avalanche breakdown.

FIG. 6 illustrates a completed quasi-lateral MOSFET 100 based on cavitywafer 32. Similar interconnection structures are used in otherembodiments to form completed MOSFET devices based on other cavity waferembodiments, e.g., cavity wafers 34, 36, or 38.

Quasi-lateral MOSFET 100 in FIG. 6 begins with cavity wafer 32 doped asillustrated in FIG. 5 a. A gate structure including gate 74 and gatedielectric 76 is formed over P-channel region 50 and partially over N+source region 60 and drift region 70. Gate 74 is conductive and, whencharged, provides the electrical field necessary to create a carrierchannel in P-channel region 50 that electrically connects drift region70 and N+ source region 60. Gate 74 is formed from polysilicon in oneembodiment. In some embodiments, a silicide layer is formed over thepolysilicon of gate 74 to reduce resistance. Gate dielectric 76 provideselectrical isolation between gate 74 and device wafer 30. In oneembodiment, two gates 74 are completely within the footprint of a singlecavity 20, i.e., each side of cavity 20 extends past an outside edge ofa gate 74. In some embodiments, drift region 70 is doped after formationof gates 74, and gates 74 are used to self-align drift region 70.

Insulating layer 78 is applied over device wafer 30 and gates 74.Insulating layer 78 contains one or more layers of prepreg,photosensitive low curing temperature dielectric resist, photosensitivecomposite resist, liquid crystal polymer (LCP), laminate compound film,insulation paste with filler, solder mask resist film, liquid moldingcompound, granular molding compound, polyimide (PI), benzocyclobutene(BCB), polybenzoxazoles (PBO), hafnium oxide (HfO2), silicon dioxide(SiO2), silicon nitride (Si3N4), silicon oxynitride (SiON), tantalumpentoxide (Ta2O5), aluminum oxide (Al2O3), solder resist, or othermaterial having similar insulating and structural properties. Insulatinglayer 78 is deposited using printing, spin coating, spray coating,lamination, or other suitable process.

A portion of insulating layer 78 is removed by etching or laser directablation (LDA) to form openings in insulating layer 78 and exposeportions of P+ body contacts 54 and N+ source regions 60. Conductivelayers 80 are formed in the openings of insulating layer 78 toelectrically contact P+ body contact 54 and N+ source region 60. Theopenings through insulating layer 78 are filled with aluminum (Al),copper (Cu), tin (Sn), nickel (Ni), gold (Au), silver (Ag), titanium(Ti), tungsten (W), or other suitable electrically conductive materialor combination thereof using PVD, CVD, electrolytic plating, electrolessplating process, or other suitable metal deposition process to formconductive layer 80. In some embodiments, conductive layer 80 is formedover cavity wafer 32 prior to formation of insulating layer 78 by asuitable plating process. A planarizing process, e.g., using a grinderor a CMP process, is performed after formation of insulating layer 78and conductive layer 80 in some embodiments.

Insulating layer 82 is formed over insulating layer 78 and conductivelayer 80. Insulating layer 82 is formed of similar materials and in asimilar process as insulating layer 78. A portion of insulating layer 82is removed to expose conductive layer 80. The openings throughinsulating layer 82 are filled with conductive material to formconductive layer 84 in a similar manner to conductive layer 80. Inembodiments where conductive layer 84 is formed prior to insulatinglayer 82, a patterning and metal deposition process such as PVD, CVD,sputtering, electrolytic plating, or electroless plating is used, and aportion of conductive layer 84 is removed prior to depositing insulatinglayer 82. Conductive layer 84 and insulating layer 82 are planarized insome embodiments. Insulating layer 86 and conductive layer 88 aresimilar to insulating layer 78 and conductive layer 80, respectively.

A conductive layer 96 is formed over substantially the entire width ofcavity wafer 32 as a source contact. When quasi-lateral MOSFET 100 iseventually packaged, conductive layer 96 provides external contact toquasi-lateral MOSFET 100. A portion 97 of conductive layer 96 iselectrically isolated and electrically coupled to gates 74 to provide anexternal gate contact. In one embodiment, conductive layer 96, includingportion 97, is directly exposed from the package of quasi-lateral MOSFET100 to be soldered to a PCB or other substrate. In other embodiments, anadditional interconnect structure, e.g., solder bumps, stud bumps, orbond wires, is formed over conductive layer 96 as a part of thepackaging process. Bond wires 101 are one embodiment of an interconnectstructure formed over quasi-lateral MOSFET 100 for externalinterconnect.

Conductive layers 80, 84, 88, and 96 constitute an interconnectstructure formed over cavity wafer 32, and provide electrical connectionto the source terminal of quasi-lateral MOSFET 100. Conductive layer 98is similar to conductive layer 96 and provides an external drain contactfor quasi-lateral MOSFET 100. In some embodiments, insulating layers 82and 86, and conductive layers 84 and 88 are not used. Conductive layer96 is formed directly in insulating layer 78 and conductive layer 80.Other numbers of insulating and conductive layers are formed over cavitywafer 32 in other embodiments. Using conductive layers 84 and 88 toincrease the distance between conductive layer 96 and handle wafer 10reduces drain-to-source capacitance.

Quasi-lateral MOSFET 100 with cavities 20 has a reduced parasiticcapacitance between the drain and source of quasi-lateral MOSFET 100.Cavities 20 increase the maximum switching frequency of quasi-lateralMOSFET 100 and reduce the amount of energy required to switchquasi-lateral MOSFET 100. In addition, cavity 20 being vacuum orgas-filled, rather than a solid insulating material, allows RESURFdesigns similar to a silicon-on-insulator device while reducing theeffect of hot-carriers and oxide charge trapping. Reducing hot-carriereffects improves the reliability of quasi-lateral MOSFET 100 becausecavity 20 does not include a solid insulating material in which chargecan become trapped.

Direct wafer-to-wafer bonding is used to form cavity 20 embedded incavity wafer 32, 34, 36, or 38. The bond between handle wafer 10 anddevice wafer 30 is at the bottom or top of cavities 20. In either case,epitaxial layer 12 may or may not be used to reduce doping concentrationat the junction between handle wafer 10 and device wafer 30. Alignmentis provided between handle wafer 10 and device wafer 30 by expanding thedrain region to include any alignment tolerances, by implanting ahigh-contrast fiducial marker visible through device wafer 30, or byfully extending drift region 70 over the contact area of handle wafer 10with device wafer 30. Drift region 70 is a superjunction,silicon-on-insulator (SOI) RESURF, or simple RESURF drift region invarious embodiments.

Quasi-lateral MOSFET 100 includes a plurality of MOSFET cells wired inparallel. FIG. 6 illustrates two MOSFET cells, 100 a and 100 b,connected in parallel, each cell including a cavity 20. In otherembodiments, many more than two MOSFET cells are wired in parallel toform a MOSFET device. Quasi-lateral MOSFET 100 is compatible withstandard power MOSFET packaging technology designed for vertical powerMOSFETs, with metal drain contact 98 on the bottom of the package, andmetal source contact 96 and metal gate contact 97 on top of the package.In some embodiments, the interconnect structure over cavity wafer 32includes metal layers providing connection from the drain ofquasi-lateral MOSFET 100, at N+ drain region 64, to the top surface ofthe device.

The subsequent figures illustrate cavities used in various other MOSFETembodiments. In addition to MOSFETs, similar cavity structures couldpotentially have advantages when used in other types of semiconductordevices, e.g., diodes or bipolar junction transistors.

FIGS. 7a-7c illustrate formation of a lateral cavity MOSFET 200. Lateralcavity MOSFET 200 is based on handle wafer 110 with cavities 120. Devicewafer 130 is bonded to handle wafer 110 over cavities 120 to form cavitywafer 132, illustrated in FIG. 7 a. Handle wafer 110 is similar tohandle wafer 10 of quasi-lateral MOSFET 100. However, handle wafer 110includes a P+ doping, which is an opposite doping of handle wafer 10 inFIG. 6. Handle wafer 110 is coupled to a source region subsequentlyformed in device wafer 130, whereas handle wafer 10 is coupled to adrain region in device wafer 30. Device wafer 130 is similar to devicewafer 30. Similar to cavities 20, cavities 120 are formed in eitherhandle wafer 110 or device wafer 130 in different embodiments. In otherembodiments, cavities 120 are formed in a relatively lightly dopedepitaxial layer grown on either handle wafer 110 or device wafer 130.Handle wafer 110 is bonded to device wafer 130 by direct wafer-to-waferbonding. Cavity 120 is formed to approximately the same size as cavity20, and can be either a stripe stretching substantially completelyacross handle wafer 10 or device wafer 30, or formed as a series of linesegments.

In FIG. 7 b, device wafer 130 is doped with the regions necessary toform MOSFET cells 200 a and 200 b. P-channel region 150 is similar toP-channel region 50. P+ body contact 154 is similar to P+ body contact54. N+ source region 160 is similar to N+ source region 60. N+ drainregion 164 is similar to N+ drain region 64. Drift region 170 is similarto drift region 70. The doping regions of device wafer 130 are similarto the doping regions of device wafer 30, except that the doping regionsof device wafer 130 have N+ drain regions 164 centered over cavities120, while P+ body contacts 54 of device wafer 30 are centered overcavities 20. Handle wafer 110 contacts P+ body contact 154, whereashandle wafer 10 contacts N+ drain region 64. Drift region 170 is asuperjunction, SOI RESURF, or simple RESURF drift region in variousembodiments, similar to drift region 70. A plurality of masks are usedas necessary to deposit the proper dopant concentrations into thevarious doped regions of device wafer 130.

Cavity wafer 132 is aligned using similar methods as cavity wafers 32,34, 36, and 38. In one embodiment, P-channel regions 150 and P+ bodycontact 154 are sized so that the contact area between handle wafer 110and device wafer 130 falls completely within the footprint of P-channelregions 150 and P+ body contact 154 at the maximum expectedmisalignment. In another embodiment, a fiducial marker is disposed inhandle wafer 110 and visible through device wafer 130.

In FIG. 7 c, gate structures, including gates 174 and gate dielectric176, are formed over P-channel regions 150. In one embodiment, driftregion 170 is doped after, and self-aligned to, gates 174. Aninterconnect structure for external interconnect is formed over cavitywafer 132. Conductive layer 180 is formed on N+ source regions 160 andP+ body contacts 154 to create metal source contacts. Conductive layer181 is formed on N+ drain regions 164 to create metal drain contacts. Inone embodiment, conductive layer 180 and conductive layer 181 are formedin openings of insulating layer 178, similar to the formation ofconductive layer 80 in FIG. 6. Insulating layers 182, 186, 190, and 194are similar to insulating layers 82 and 86. Conductive layers 184, 185,188, 189, 192, 193, and 195 are similar to conductive layers 84 and 88.Conductive layer 196 is formed as a stripe oriented left to right inFIG. 7 c. Conductive layer 196 provides external connection to P+ bodycontact 154 and N+ source region 160. Lateral cavity MOSFET 200 includesconductive layer 196 formed as a plurality of stripes, each connected toP+ body contact 154 and N+ source region 160. The stripes of conductivelayer 196 are interleaved with stripes 197, which are coupled to N+drain region 164 through portions of conductive layer 195.

In some embodiments, the portion of handle wafer 110 around cavities 120and contacting device wafer 130 is designed to provide an effect similarto field plates. Handle wafer 110 near P-channel 150 shields gate 174from the source electric field of lateral cavity MOSFET 200. A higherdopant concentration is possible in drift region 170 by reducing theelectric field experienced at gate 174, which reduces on-stateresistance of lateral cavity MOSFET 200. In addition, an electric fieldfrom handle wafer 110 across cavity 120 helps deplete drift region 170,allowing further increase in doping of drift region 170.

Conductive layers 180, 184, 188, 192, 195, and 196 provideinterconnection from P+ body contact 154 and N+ source region 160 oflateral cavity MOSFET 200 to an external PCB or other substrate.Conductive layers 181, 185, 189, 193, 195, and 197 provide externalinterconnection to N+ drain region 164 of lateral cavity MOSFET 200.Conductive layer 197 is formed as stripes interleaved with stripes ofconductive layer 196, and provides interconnection from conductive layer193 to the top surface of lateral cavity MOSFET 200 via portions ofconductive layer 195. In other embodiments, any number of conductive andinsulating layers are formed over cavity wafer 132 to provide externalinterconnect. An optional conductive layer 198 is formed on the surfaceof handle wafer 110 opposite cavities 120 as a source contact in someembodiments.

Lateral cavity MOSFET 200 includes cavities 120 to reduce capacitancefrom drain to source. Lateral cavity MOSFET 200 is compatible with powerMOSFET packaging technology designed for lateral power MOSFETs,including land grid array, ball grid array, and copper pillar packaging.Source, drain, and gate contacts are all located on a top surface oflateral cavity MOSFET 200. FIG. 7c illustrates two MOSFET cells, 200 aand 200 b, connected in parallel, but any number of MOSFET cells arewired in parallel in other embodiments. Each MOSFET cell extendsperpendicular to the page of FIG. 7 c, and has a length that iscustomized to the requirements of specific embodiments.

FIGS. 8a-8d illustrate formation of a vertical trench MOSFET cell 300.In FIG. 8 a, a handle wafer 210 is provided. Cavities 220 are formed inhandle wafer 210. Cavities 220 are similar to cavities 20 and 120, butoriented vertically rather than horizontally. A plurality of parallelcavities 220 are formed, with each cavity comprising a vertical trenchextending perpendicular to the page of FIG. 8 a. Each vertical trenchMOSFET cell 300 formed on handle wafer 210 includes a single cavity 220.Doped regions 222 and 224 are formed in handle wafer 210 adjacent tocavity 220 using an angled implantation, and form a charge balancedsuperjunction drift region. In one embodiment, a simple lightly-dopeddrift (LDD) region is used instead of a charge-balanced superjunction.In some embodiments, doped regions 222 and 224 are formed into asuperjunction by successively growing and then doping one or moreepitaxial layers on handle wafer 210.

The width of cavity 220 is between one and two μm in one embodiment. Thedepth of cavity 220 is dependent on the mechanical constraints ofregions 222 and 224 being able to support the structure of verticaltrench MOSFET 300. Cavities 220 may be formed as long stripes across anentire handle wafer 210, or broken into an array of line segments.

In FIG. 8 b, device wafer 230 is disposed over handle wafer 210 andcavity 220. Device wafer 230 is bonded to handle wafer 210 using directwafer-to-wafer bonding to enclose cavity 220. In some embodiments,cavity 220 is formed in or over device wafer 230, and doped regions 222and 224 are formed in device wafer 30. Then device wafer 230, includingcavities 220 and doped regions 222 and 224, is disposed over and bondedto handle wafer 210.

FIG. 8c illustrates the functional regions of a MOSFET formed in devicewafer 230. Region 232 forms a part of the drift region along with dopedregions 222 and 224. P-channel regions 250 block current throughvertical trench MOSFET 300 until a sufficient charge on gate 274 createsa channel of majority carriers through P-channel regions 250. N+ sourceregion 260 and P+ body contact 254 operate similarly to N+ source region60 and P+ body contact 54, respectively, and provide good ohmic contactwith a subsequently formed conductive layer. Gate 274 is formed bydepositing conductive material in a trench over cavity 220 and extendingperpendicular with the page of FIG. 8 c. Gate dielectric 276electrically isolates gate 274 from device wafer 230.

The doped regions of vertical trench MOSFET 300 are aligned usingsimilar methods as cavity wafers 32, 34, 36, and 38. In one embodiment,cavity 220 is large enough that gate 274 falls completely within thefootprint of cavity 220 at the maximum expected misalignment. In anotherembodiment, a fiducial marker is disposed in handle wafer 210 or dopedregions 222 and 224, and visible through device wafer 230 for alignment.

In FIG. 8 d, metal layers 288 and 296 are formed over device wafer 230to provide external interconnection to P+ body contact 254 and N+ sourceregion 260. Dielectric layer 286 provides additional separation betweenmetal layer 296 and gate 274, reducing gate to source capacitance.Conductive layer 298 is formed over handle wafer 210 as an externaldrain contact.

Vertical trench MOSFET 300 is a vertical MOSFET. The vertical driftregion formed by doped regions 222, 224, and 232 provides lowerarea-specific on-resistance but higher area-specific capacitance thanthe lateral designs of quasi-lateral cavity MOSFET 100 and lateralcavity MOSFET 200. Cavity 220 helps reduce the parasitic capacitance ofvertical trench MOSFET 300. Vertical trench MOSFET 300 is singulated toinclude any number of adjacent cavities 220, and any necessary length ofcavities 220, as required to create a final packaged device with desiredcharacteristics. FIG. 8d illustrates a single MOSFET cell, but eachadjacent cavity 220 includes a similar MOSFET cell around cavity 220coupled in parallel.

FIGS. 9a-9d illustrate formation of a vertical planar-gate MOSFET 400.Handle wafer 310 includes relatively lightly N-doped regions 312 andP-doped region 314 formed on handle wafer 10 as a drift region. Regions312 and 314 form a charge-balanced superjunction, and are formed bysuccessively forming and then doping the regions in one or moreepitaxial layers.

In FIG. 9 b, cavities 320 are formed in doped regions 312 and 314.Cavities 320 are formed similarly to cavity 20. Device wafer 330 isdisposed over and bonded to regions 312 and 314 using directwafer-to-wafer bonding. In one embodiment, cavities 320 are between fourand twelve μm wide and between one and ten μm deep. Cavities 320 can bestripes extending perpendicularly across substantially an entire handlewafer 310 or broken into an array of line segments.

In FIG. 9 c, the operable regions of vertical planar-gate MOSFET 400 aredoped into device wafer 330. P+ body contact 354 and N+ source region360 are formed and operate similarly to P+ body contact 54 and N+ sourceregion 60, respectively. P-channel region 350 is similar to P-channelregion 50. N+ drain regions 364 are similar to N+ drain regions 64.

FIG. 9d illustrates gate 374 and gate dielectric 376 formed overP-channel region 350. Gate 374 is similar to gate 74. Insulating layer378 is formed over gates 374, and conductive layer 380 is formed in anopening of insulating layer 378. In one embodiment, each gate 374 islocated completely within a footprint of a corresponding cavity 320.Insulating layer 382 and conductive layer 384 are formed over insulatinglayer 378. Insulating layer 386 and conductive layer 388 are formed overinsulating layer 382 and conductive layer 384. Conductive layer 396 isformed over substantially the entire top surface of conductive layer 388and insulating layer 386 as a source contact. A portion of conductivelayer 396 is electrically isolated from the remainder of conductivelayer 396 and utilized as a contact to gates 374. The remainder ofconductive layer 396 is coupled to P+ body contact 354 and N+ sourceregion 360 via conductive layers 380, 384, and 388. Conductive layer 398is formed over substantially the entire bottom surface of handle wafer310 as a drain contact. Vertical planar-gate MOSFET 400 is singulatedand packaged after formation of conductive layers 396 and 398. OneMOSFET cell is illustrated in FIG. 9 d, but any number of MOSFET cellsare formed on handle wafer 310 and coupled in parallel.

Doping of device wafer 330 is aligned to cavities 320 using similarmethods as cavity wafers 32-38. Gates 374 are sized and positioned suchthat gates 374 are over cavities 320 even under the highest expectedmisalignment. In another embodiment, a fiducial marker is disposed inregions 312 or 314 and visible through device wafer 330.

Terms of relative position as used in this application are defined basedon a plane parallel to the conventional plane or working surface of awafer or substrate, regardless of the orientation of the wafer orsubstrate. The term “horizontal” or “lateral” as used in thisapplication is defined as a plane parallel to the conventional plane orworking surface of a wafer or substrate, regardless of the orientationof the wafer or substrate. The term “vertical” refers to a directionperpendicular to the horizontal. Terms such as “on,” “side” (as in“sidewall”), “higher,” “lower,” “over,” “top,” and “under” are definedwith respect to the conventional plane or working surface being on thetop surface of the wafer or substrate, regardless of the orientation ofthe wafer or substrate.

While one or more embodiments of the present invention have beenillustrated in detail, the skilled artisan will appreciate thatmodifications and adaptations to those embodiments may be made withoutdeparting from the scope of the present invention as set forth in thefollowing claims.

What is claimed is:
 1. A method of making a semiconductor device,comprising: providing a first semiconductor wafer; forming a cavity inthe first semiconductor wafer; bonding a second semiconductor wafer tothe first semiconductor wafer over the cavity; and forming a transistorincluding a first portion of the transistor disposed over the cavity anda second portion of the transistor disposed outside a footprint of thecavity, wherein forming the cavity includes forming sidewalls of thecavity, the sidewalls defining outermost boundaries of the footprint,and wherein forming the transistor including the second portion includesforming the second portion outside the outermost boundaries of thefootprint.
 2. The method of claim 1, wherein forming the transistorfurther includes: forming a P-channel region over the cavity; forming adrain region outside the footprint of the cavity; and forming a driftregion between the P-channel region and drain region.
 3. The method ofclaim 1, further including forming a superjunction over the cavity inthe first semiconductor wafer or second semiconductor wafer.
 4. Themethod of claim 3, further including forming a channel region adjacentto the superjunction.
 5. The method of claim 1, further includingforming a fiducial marker in the first semiconductor wafer.
 6. Themethod of claim 1, further including forming an epitaxial layer on thefirst semiconductor wafer prior to forming the cavity.
 7. A method ofmaking a semiconductor device, comprising: providing a firstsemiconductor die; forming a cavity in the first semiconductor die;bonding a second semiconductor die to the first semiconductor die overthe cavity; and forming a transistor including a gate of a transistorformed over the cavity and another portion of the transistor disposedoutside a footprint of the cavity, wherein forming the cavity includesforming sidewalls of the cavity, the sidewalls defining outermostboundaries of the footprint, and wherein forming the transistorincluding the another portion includes forming the another portionoutside the outermost boundaries of the footprint.
 8. The method ofclaim 7, further including forming the gate in a trench.
 9. The methodof claim 7, further including forming a drift region entirely within thefootprint of the cavity.
 10. The method of claim 7, further includingforming the gate over the first semiconductor die.
 11. The method ofclaim 7, further including forming the gate over the secondsemiconductor die.
 12. The method of claim 7, further including formingan interconnect structure over the gate.
 13. A semiconductor device,comprising: a first semiconductor die including a cavity formed in thefirst semiconductor die; a second semiconductor die bonded to the firstsemiconductor die over the cavity; and a first transistor including aportion of the first transistor formed over the cavity and a secondportion of the transistor disposed outside a footprint of the cavity,wherein the cavity includes sidewalls defining outermost boundaries ofthe footprint, and wherein the second portion of the transistor isdisposed outside the outermost boundaries of the footprint.
 14. Thesemiconductor device of claim 13, further including an epitaxial layerdisposed around the cavity.
 15. The semiconductor device of claim 13,further including a fiducial marker disposed between the firstsemiconductor die and second semiconductor die.
 16. The semiconductordevice of claim 13, further including a superjunction formed in thefirst semiconductor die or second semiconductor die.
 17. Thesemiconductor device of claim 13, further including a reduced surfacefield (RESURF) drift region formed in the first semiconductor die orsecond semiconductor die.
 18. The semiconductor device of claim 13,further including a second transistor including a portion of the secondtransistor formed over the cavity.
 19. The semiconductor device of claim13, further including: a first conductive layer disposed over the firstsemiconductor die; and a second conductive layer disposed over thesecond semiconductor die.